Microelectronic Devices Yang Pdf !!LINK!! Download
Microelectronic Devices Yang Pdf Download
the sheet resistance (rs) of the transferred semiconductor materials is estimated to be 200-600 ω/sq (sheet resistivity between 200-400 ω/sq for majority-type semiconductors). we also measured the wetting of the natural gecko adhesives on various target substrates (figure 1 e and 1 f). we observed that the natural gecko adhesives have a good affinity for polydimethylsiloxane (pdms), epoxy, and normal glass, whereas a poor affinity for epoxy-glass bonded interfaces or nickel. we demonstrate the transfer printing of inorganic semiconductor materials using these natural gecko adhesives (figure 1 g and 1 h). the size of the semiconductor material can be determined by the size of the punctures (figure 1 i), whereas the conductive feature on the microelectronics can be determined by the conductive structures (figure 1 j). the transfer-printing of the materials is accompanied by the generation of holes on the original substrate (figure 1 k).
we prepared microelectronic devices on silicon substrates, using a conventional uv lithography process followed by an evaporation process, after which the si chip is diced (figure 1 l). the size of the si chips ranges between 10-25 mm2. the chip can be permanently bonded with the elastic setal adhesive, after which it can be operated without a glue or an integrated circuit (ic). to further reinforce the bonding stability and to improve mechanical strength of the bonding interface, we added epoxy resin (glycidyl methacrylate (gma)) on the bonding areas of the substrate and setal adhesives. the setal adhesive is gently pushed onto the chip with a glass slide for 10 s, after which the surface of the adhesive is completely covered with the epoxy adhesive. to further improve the mechanical strength of the bonding interface, we used a laser process (figure 1 m) to melt the setal adhesive on the chip so that the epoxy resin will penetrate and fill the gap between the substrate and the setal adhesive. figure 1 n shows the transfer-printing of microscopic n-type silicon oxide semiconductor devices onto a root epidermal hair of the tomato plant, and figure 1 o shows the transfer-printing of a resistor onto an insect wing. we measured the contact angles (θ) of the epoxy adhesive and the setal adhesive using a contact angle measurement instrument (fukuda dsa 100). the average contact angle of the epoxy and setal adhesives is 70 ± 10 and 65 ± 15 degrees, respectively.
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